IEC-TR-62380 is a standard developed by the French industry to calculate the MTBF (Mean Time between Failure) of electronic systems. IEC-TR-62380 was officially "replaced" by IEC 61709:2017 in 2017. However, it should be noted that IEC 61709 is only a "blank" that cannot be used in this form for practical calculations, like the MTBF calculation standards presented here. (It is interesting in this context that Siemens SN 29500 is a "ready-to-use" IEC 61709 standard).
- From the basic approach IEC-TR-62380 is actually contemporary / progressive
- Rather bloated set of formulas, measured by the information processed in it
- IEC-TR-62380 is practically only used when French are somehow involved. (Therefore rarely used for MTBF calculation).
- Is hardly ever used in the area of functional safety
The unique selling point of IEC-TR-62380 compared to all other standards is the consideration not only of static temperatures, but also of temperature changes to which a system is exposed. IEC-TR-62380 thus addresses systems that are exposed to frequent temperature changes. Another unique feature is the consideration of the electrical environment for all ICs and semiconductors.
The formula effort of IEC-TR-62380 even exceeds the Telcordia SR-332 standard, but it looks like different approaches from different working groups have been collected and thrown together to one standard. Furthermore, the English edition of the IEC-TR-62380 has considerable deficiencies regarding structuring and didactics. The last point of criticism also applies to the -also French- standard FIDES 2009.
A direct successor to IEC-TR-62380 is not in sight and most probably not planned. The FIDES standard will probably follow in its footsteps.
